052-6408 rev a 1-2013 apt25gr120b_s symbol parameter ratings unit v ces collector emitter voltage 1200 v v ge gate-emitter voltage 30 i c1 continuous collector current @ t c = 25c 75 a i c2 continuous collector current @ t c = 125c 25 i cm pulsed collector current 1 100 scwt short circuit withstand time: v ce = 600v, v ge = 15v, t c =125c 10 s p d total power dissipation @ t c = 25c 521 w t j ,t stg operating and storage junction temperature range -55 to 150 c t l max. lead temp. for soldering: 0.063" from case for 10 sec. 300 maximum ratings all ratings: t c = 25c unless otherwise speci ? ed. static electrical characteristics microsemi website - http://www.microsemi.com caution: these devices are sensitive to electrostatic discharge. proper handling procedures should be followed. symbol parameter min typ max unit v (br)ces collector-emitter breakdown voltage (v ge = 0v, i c = 500 a) 1200 volts v ge(th) gate threshold voltage (v ce = v ge , i c = 1.0ma, t j = 25c) 3.5 5.0 6.5 v ce(on) collector-emitter on voltage (v ge = 15v, i c = 25a, t j = 25c) 2.5 3.2 collector-emitter on voltage (v ge = 15v, i c = 25a, t j = 125c) 3.3 collector-emitter on voltage (v ge = 15v, i c = 50a, t j = 25c) 3.5 i ces collector cut-off current (v ce = 1200v, v ge = 0v, t j = 25c) 2 5 500 a collector cut-off current (v ce = 1200v, v ge = 0v, t j = 125c) 2 50 i ges gate-emitter leakage current (v ge = 20v) 250 na ultra fast npt - igbt ? the ultra fast npt - igbt ? family of products is the newest generation of planar igbts optimized for outstanding ruggedness and the best trade-off between conduction and switching losses. features low saturation voltage low tail current rohs compliant short circuit withstand rated high frequency switching ultra low leakage current unless stated otherwise, microsemi discrete igbts contain a single igbt die. this device is recommended for applications such as induction heating (ih), motor control, general purpose inverters and uninterruptible power supplies (ups). apt25gr120b APT25GR120S 1200v, 25a, v ce(on) = 2.5v typical t o - 2 4 7 g c e d 3 pa k g c e (s) (b) downloaded from: http:///
apt25gr120b_s 052-6408 rev a 1-2013 thermal and mechanical characteristics dynamic characteristics 1 repetitive rating: pulse width and case temperature limited by maximum junction temperature. 2 pulse test: pulse width < 380 s , duty cycle < 2%. 3 see mil-std-750 method 3471.4 r g is external gate resistance, not including internal gate resistance or gate driver impedance. (mic4452) 5 e on2 is the clamped inductive turn on energy that includes a commutating diode reverse recovery current in the igbt turn on energy loss. a combi device is used for the clamping diode.6 e off is the clamped inductive turn-off energy measured in accordance with jedec standard jesd24-1. microsemi reserves the right to change, without notice, the speci? cations and information contained herein. symbol parameter test conditions min typ max unit c ies input capacitance capacitance v ge = 0v, v ce = 25v f = 1mhz 2784 pf c oes output capacitance 271 c res reverse transfer capacitance 75 v gep gate to emitter plateau voltage gate charge v ge = 15v v ce = 600v i c = 25a 7.5 v q g 3 total gate charge 154 203 nc q ge gate-emitter charge 20 27 q gc gate- collector charge 76 97 t d(on) turn-on delay time inductive switching (25c) v cc = 600v v ge = 15v i c = 25a r g = 4.3 4 t j = +25c 16 ns t r current rise time 10 t d(off) turn-off delay time 122 t f current fall time 20 e on2 5 turn-on switching energy 742 1110 j e off 6 turn-off switching energy 427 640 t d(on) turn-on delay time inductive switching (125c) v cc = 600v v ge = 15v i c = 25a r g = 4.3 4 t j = +125c 16 ns t r current rise time 10 t d(off) turn-off delay time 136 t f current fall time 28 e on2 5 turn-on switching energy 1297 1945 j e off 6 turn-off switching energy 480 720 0 0.05 0.10 0.15 0.20 0.25 10 -4 10 -3 10 -2 0.1 1 10 -5 z jc , thermal impedance (c/w) 0.3 d = 0.9 0.7 single pulse rectangular pulse duration (seconds) figure 1, maximum effective transient thermal impedance, junction-to-case vs pulse duration 0.5 0.1 0.05 peak t j = p dm x z jc +t c duty factor d = t 1 / t 2 t 2 t 1 p dm note: symbol characteristic min typ max unit r jc junction to case thermal resistance .24 c/w r ja junction to ambient thermal resistance 40 w t package weight .22 oz 6.2 g torque mounting torque (to-247 package), 4-40 or m3 screw 10 in-lbf 6.2 n ? m downloaded from: http:///
052-6408 rev a 1-2013 apt25gr120b_s typical performance curves 0 10 20 30 40 50 60 70 80 90 100 -50 -25 0 25 50 75 100 125 150 0 1 2 3 4 5 6 -50 0 50 100 150 0 1 2 3 4 5 6 6 8 10 12 14 16 0 40 80 120 160 200 0 2 4 6 8 10 12 0 20 40 60 80 100 120 140 160 180 0 4 8 12 16 20 24 28 32 0 50 100 150 200 0 2 4 6 8 10 12 250 s pulse test<0.5 % duty cycle t j = 25c. 250 s pulse test <0.5 % duty cycle v ge = 15v. 250 s pulse test <0.5 % duty cycle i c = 12.5a i c = 25a i c = 50a i c = 25a i c = 50a 13v 15v t j = 25c t j = -55c v ge = 15v t j = - 55c t j = 150c v ce , collector-to-emitter voltage (v) figure 3, saturation voltage characteristics (t j = 25c) i c , collector current (a) t j = 25c t j = 125c v ce , collector-to-emitter voltage (v) figure 4, output characteristics (t j = 25c) i c , collector current (a) t j = 125c v ge , gate-to-emitter voltage (v) figure 6, transfer characteristics i c , collector current (a) v ge , gate-to-emitter voltage (v) figure 7, on state voltage vs gate-to-emitter voltage v ce , collector-to-emitter voltage (v) t j , junction temperature (c) figure 5, on state voltage vs junction temperature v ce , collector-to-emitter voltage (v) t c , case temperature (c) figure 9, dc collector current vs case temperature i c , dc collector current (a) 0.85 0.90 0.95 1.00 1.05 1.10 1.15 -50 -25 0 25 50 75 100 125 t j , junction temperature figure 8, breakdown voltage vs junction temperature bv ces , breakdown voltage 6.5v 7v i c = 12.5a 8.0v 8.5v 7.5v 9v i c (a) figure 2, max frequency vs current (t case = 75c) t j = 150c 0 50 100 150 200 250 300 350 0 10 20 30 40 50 frequency (khz) downloaded from: http:///
apt25gr120b_s 052-6408 rev a 1-2013 typical performance curves 0 2 4 6 8 10 12 14 16 18 20 0 50 100 150 200 i c = 25a t j = 25c v ce = 960v v ce = 600v v ce = 240v gate charge (nc) figure 11, gate charge v ge , gate-to-emitter voltage (v) 1 10 100 0 10 20 30 40 50 10 100 1000 10 20 30 40 50 100 1000 1400 0 25 50 75 100 125 100 1000 3000 0 10 20 30 40 50 100 1000 10000 10 20 30 40 50 v ce = 600v, v ge =15v, r g = 4.3 t j = 25c or 125c t d(on) i ce , collector-to-emitter current (a) figure 12, turn-on time vs collector current switching time (ns) i ce , collector-to-emitter current (a) figure 13, turn-off time vs collector current switching time (ns) r g , gate resistance ( ) figure 15, energy loss vs gate resistance i ce , collector-to-emitter current (a) figure 14, energy loss vs collector current switching energy loss ( j) t j , junction temperature (c) figure 16, switching energy vs junction temperature switching energy losses ( j) t r t d(off) t f v ce = 600v, v ge =15v, r g = 4.3 t j = 25c t j = 125c v ce = 600v, v ge =15v, r g = 4.3 t j = 25c t j = 125c e on2 e off e on2 e off switching energy loss ( j) e off e on2 v ce = 600v, v ge =15v, r g = 4.3 i c = 25a 1.0e ? 11 1.0e ? 10 1.0e ? 9 1.0e ? 8 0 10 20 30 40 50 c oes c res c ies v ce , collector-to-emitter voltage (volts) figure 10, capacitance vs collector-to-emitter voltage c, capacitance (f) 1 10 100 200 1 10 100 1000 3000 v ce , collector-to-emitter voltage figure 17, minimum switching safe operating area i c , collector current (a) 100 s 10ms .1ms 100ms v ce = 600v, v ge =15v, i c = 25a t j = 125c 1ms downloaded from: http:///
052-6408 rev a 1-2013 apt25gr120b_s 15.49 (.610)16.26 (.640) 5.38 (.212)6.20 (.244) 6.15 (.242) bsc 4.50 (.177) max. 19.81 (.780)20.32 (.800) 20.80 (.819)21.46 (.845) 1.65 (.065)2.13 (.084) 1.01 (.040)1.40 (.055) 3.50 (.138)3.81 (.150) 2.87 (.113)3.12 (.123) 4.69 (.185)5.31 (.209) 1.49 (.059) 2.49 (.098) 2.21 (.087)2.59 (.102) 0.40 (.016)0.79 (.031) collector collector emitter gate 5.45 (.215) bsc 2-plcs. 15.95 (.628)16.05(.632) 1.22 (.048)1.32 (.052) 5.45 (.215) bsc {2 plcs. } 4.98 (.196)5.08 (.200) 1.47 (.058) 1.57 (.062) 2.67 (.105)2.84 (.112) 0.46 (.018) {3 plcs} 0.56 (.022) heat sink (collector)and leads are plated 3.81 (.150)4.06 (.160) (base of lead ) collector(heat sink) 1.98 (.078)2.08 (.082) gate collector emitter 0.020 (.001)0.178 (.007) 1.27 (.050)1.40 (.055) 11.51 (.453)11.61 (.457) 13.41 (.528)13.51(.532) revised8/29/97 1.04 (.041)1.15(.045) 13.79 (.543)13.99(.551) revised 4/18/95 to-247 package outline d 3 pak package outline dimensions in millimeters (inches) dimensions in millimeters (inches) downloaded from: http:///
apt25gr120b_s 052-6408 rev a 1-2013 the information contained in the document (unless it is publicly available on the web without access restrictions) is proprieta ry and confidential information of microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of microsemi. if the recipient of this document has entered into a disclosure agreement with microsemi, then the terms of such agreement will also apply . this document and the information contained herein may not be modi ? ed, by any person other than authorized personnel of microsemi. no license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or otherwise. any license under such intellectual property rights must be approved by microsemi in writing signed by an of ? cer of microsemi.microsemi reserves the right to change the con ? guration, functionality and performance of its products at anytime without any notice. this product has been subject to limited testing and should not be used in conjunction with life-support or other mission-critical equipment or applications. microsemi assumes no liability whatsoever, and microsemi disclaims any express or implied warranty, relating to sale and/or use of microsemi products including liability or warranties relating to ? tness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. any performance speci ? cations believed to be reliable but are not veri ? ed and customer or user must conduct and complete all performance and other testing of this product as well as any user or customers ? nal application. user or customer shall not rely on any data and performance speci ? cations or parameters provided by microsemi. it is the customers and users responsibility to independently determine suitability of any microsemi product and to test and verify the same. the information contained herein is provided as is, where is and with all faults, and the entire risk associated with such information is entirely with the user. mi- crosemi speci ? cally disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost pro ? t. the product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp downloaded from: http:///
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